Powering Next-Gen AI: How high-performance molded powder inductors boost AI computing power
13:01
0:00 - Introduction 1:14 - Global datacenter vs.AI-related power consumption 2:35 - 800HVDC power architecture 3:41 - Inductor & core materials requirements driven by AI computing power trend 5:26 - Key criteria for selecting a AI inductor supplier 5:40 - Advantages of molded metal powder inductors 6:36 - Optimizing power distribution for xPU - Vertical power delivery 8:17 - Eaton molded power inductor product roadmap 9:35- Q&A As AI computing continues to evolve, the need for power components that deliver both exceptional efficiency and high power density has become critical. This webinar explores how high-performance molded powder inductors are raising the bar in next-generation AI systems. Participants will learn how these inductors outperform traditional assembled ferrite designs by offering: - Higher system efficiency - Higher power density - Enhanced temperature stability - Improved thermal management - Robust EMI immunity These attributes are essential for maintaining maximum processing power stability, scalability, and overall system performance in new generation AI hardware. Engineers will gain valuable insights into the design advantages and application benefits of molded powder inductors, and why they are rapidly becoming the preferred choice for existing and next-generation AI platforms.
0:00 - Introduction 1:14 - Global datacenter vs.AI-related power consumption 2:35 - 800HVDC power architecture 3:41 - Inductor & core materials requirements driven by AI computing power trend 5:26 - Key criteria for selecting a AI inductor supplier 5:40 - Advantages of molded metal powder inductors 6:36 - Optimizing power distribution for xPU - Vertical power delivery 8:17 - Eaton molded power inductor product roadmap 9:35- Q&A As AI computing continues to evolve, the need for power components that deliver both exceptional efficiency and high power density has become critical. This webinar explores how high-performance molded powder inductors are raising the bar in next-generation AI systems. Participants will learn how these inductors outperform traditional assembled ferrite designs by offering: - Higher system efficiency - Higher power density - Enhanced temperature stability - Improved thermal management - Robust EMI immunity These attributes are essential for maintaining maximum processing power stability, scalability, and overall system performance in new generation AI hardware. Engineers will gain valuable insights into the design advantages and application benefits of molded powder inductors, and why they are rapidly becoming the preferred choice for existing and next-generation AI platforms.
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